Mil-Hdbk-251 - Reliability design thermal applications
Keywords: Best Practices ; Handbook ; Information exchange ; Maintainance ; Qualification test ; Reliability ; Safety ; Security techniques ; Specification ; Standard
Document ID:Mil-Hdbk-251
Overview
| Title: |
Reliability ⁄ design thermal applications |
| Scope: |
This handbook recommends and presents electronic parts stress analysis methods which lead to the selection of maximum safe temperatures for parts so that the ensuing thermal design is consistent with the required equipment reliability. These maximum parts temperature must be properly selected since they are the goals of the thermal design, a fact which is often overlooked. Many thermal designs are inadequate because improper maximum parts temperture were selected as design goals. Consequently, the necessary parts stress analysis procedures have been emphasized. Specific step by step thermal design procedures are given in chapter 4. |
| Document Status: |
Active |
Doc Date: |
19-JAN-1978 |
QPL⁄QML: |
None |
| FSC⁄Area: |
SESS |
Dist Stmt: |
A |
|
|
| Doc Category: |
Military Handbooks |
|
